This sponsored article is dropped at you by Grasp Bond.
Grasp Bond EP112 is an ultra-low-viscosity, electrically insulating, two-component warmth curable epoxy system designed for demanding purposes requiring optical readability and resistance to chemical substances generally utilized in silicon processing. This text introduces a two-part case examine involving a microelectronics fabrication, showcasing EP112’s function in bonding a silicon wafer to a glass substrate.
Half 1: The START Course of and EP112’s Function
Within the first a part of this case examine, researchers at Lawrence Livermore Nationwide Laboratory (LLNL) developed an revolutionary Silicon-on-Insulator (SOI) course of referred to as START (Silicon Switch to Arbitrary Substrate). This methodology permits the transformation of ordinary bulk silicon wafers with accomplished circuits into SOI-like configurations with out considerably rising manufacturing prices. By utilizing standard fabrication methods, the START course of combines the advantages of bulk silicon electronics with these of SOI know-how whereas sustaining price effectivity.
A vital step on this course of concerned bonding a silicon wafer to a glass help substrate. EP112 was chosen because the adhesive of selection resulting from its ultra-low viscosity, robust bonding capabilities, and excessive chemical resistance. The bonded construction finally contributed to the profitable growth of a prototype liquid crystal show (LCD), demonstrating EP112’s effectiveness in microelectronics fabrication.
Half 2: CMOS Wafer Thinning for SEU Resistance
Within the second a part of this examine, LLNL researchers utilized EP112 in a novel wafer-thinning course of to boost the reliability of CMOS-based built-in circuits (ICs). The target was to scale back susceptibility to Single Occasion Upsets (SEUs) by considerably reducing the cost assortment quantity throughout the silicon substrate.
To attain this, EP112 was used to bond two substrates collectively, making certain a safe attachment all through the wafer-thinning steps. The method concerned a high-temperature alkaline etching step, the place EP112’s superior chemical resistance performed a vital function in stopping de-bonding. By sustaining structural integrity underneath these harsh circumstances, EP112 enabled the profitable completion of the thinning course of, additional demonstrating its suitability for superior semiconductor purposes.
To learn extra about the important thing parameters and necessities, and study concerning the outcomes, please obtain the total case examine right here.
